@alessandro@lemmy.ca to PC Gaming@lemmy.ca • 2 months agoIntel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 1.4nm process development in 2025www.tomshardware.comexternal-linkmessage-square3fedilinkarrow-up148arrow-down11file-text
arrow-up147arrow-down1external-linkIntel completes assembly of first commercial High-NA EUV chipmaking tool — addresses cost concerns, preps for 1.4nm process development in 2025www.tomshardware.com@alessandro@lemmy.ca to PC Gaming@lemmy.ca • 2 months agomessage-square3fedilinkfile-text
minus-square@Wahotslink2•2 months agoThe next few years of chip designs are going to be really interesting. The PowerVia innovations are really cool. I am curious if that will free up some room for other things that previously needed power delivery on the front of the chip.
The next few years of chip designs are going to be really interesting. The PowerVia innovations are really cool. I am curious if that will free up some room for other things that previously needed power delivery on the front of the chip.